Using the of modern methods of experimental design in the development of devices for layer by layer assembly of thin films installation

Abstract

Results of the experimental design and manufacturing systems for carrying out the layer by layer assembly thin films on the surface of the solid substrate are given in our article. Microcontrollers from STMicroelectronics STM32F103CBT6 is the basis of the control electronics of the unit. FDM fusing laminating method was used to manufacture the mechanical components of the installation. algorithm of work installation and electric circuit diagram shown in the article.