Fabrication of titanium films by magnetron sputtering for synthesizing porous films titanium dioxide

Abstract

In this paper presents the results of a microstructure study of the films obtained by magnetron sputtering system (MSS). This system collected on the basis of VUP-4. The developed MSS produces films with high deposition rate with a minimum of visible defects in the structure. Spray rate control performed by changing the sputtering voltage, which leads to a change in current, which increases and/or reduces the degree of ionization of the gas and dislodge target atoms. It is found that with increasing voltage of 300 to 600 V in the film growth rate increased from 2.4 to 4 angstroms per second. It was found that the stress of about 400 V in the granule was the film have a larger structure than the films obtained at 500 V and 600 V. An elemental analysis of the films produced by the energy dispersive analysis.